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The microminiaturization of LSIs has led to an increase in variations in the device characteristics.
Kilby had developed what TI called a ‘solid circuit,’ and what TI hailed as the ultimate in microminiaturization .
One approach to microminiaturization is to incorporate dissipation and decoherence into device design in order to create small electronic devices that have properties similar to their larger counterparts.
The new SOP packaging platform prototype enables microminiaturization of consumer products through the elimination of surface passive components and interconnection lengths, while significantly improving performance.
The microminiaturization technology deals with overlapping disciplines, involving microelectronics, solid-state electronics, photoelectronics, physics, mechanics and material science.
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